65 nanometers is the next goal of the Zelenograd Angstrem-T plant, which will cost 300-350 million euros. The enterprise has already submitted an application for a soft loan for the modernization of production technologies to Vnesheconombank (VEB), Vedomosti reported this week, citing Leonid Reiman, Chairman of the Board of Directors of the plant. Now Angstrem-T is preparing to launch a line for the production of chips with a 90nm topology. Payments on the previous VEB loan, for which it was purchased, will begin in mid-2017.

Beijing collapsed Wall Street

Key US indices marked the first days of the New Year with a record fall, billionaire George Soros has already warned that the world is waiting for a repeat of the 2008 crisis.

The first Russian consumer processor Baikal-T1 at a price of $60 is launched into mass production

The Baikal Electronics company at the beginning of 2016 promises to launch the Russian Baikal-T1 processor worth about $60 into industrial production. Devices will be in demand if this demand is created by the state, market participants say.

MTS and Ericsson will jointly develop and implement 5G in Russia

PJSC "Mobile TeleSystems" and Ericsson signed agreements on cooperation in the development and implementation of 5G technology in Russia. In pilot projects, including during the 2018 World Cup, MTS intends to test the developments of the Swedish vendor. At the beginning of next year, the operator will start a dialogue with the Ministry of Telecom and Mass Communications on the formation of technical requirements for the fifth generation of mobile communications.

Sergey Chemezov: Rostec is already one of the ten largest engineering corporations in the world

In an interview with RBC, the head of Rostec, Sergey Chemezov, answered burning questions: about the Platon system, the problems and prospects of AVTOVAZ, the interests of the State Corporation in the pharmaceutical business, spoke about international cooperation under sanctions pressure, import substitution, reorganization, development strategies and new opportunities in difficult times.

Rostec is "protected" and encroaches on the laurels of Samsung and General Electric

The Supervisory Board of Rostec approved the "Development Strategy until 2025". The main tasks are to increase the share of high-tech civilian products and catch up with General Electric and Samsung in key financial indicators.

Chip lead forming

When preparing microcircuits for mounting on printed circuit boards (the operations of straightening, forming and trimming the leads), the leads are subjected to stretching, bending and compression. Therefore, when performing forming operations, it is necessary to ensure that the tensile force is minimal. Depending on the cross section of the pins of the microcircuits, it should not exceed certain values (for example, for the cross section of the pins from 0.1 to 2 mm 2, no more than 0.245 ... 19.6 N).

Forming of terminals of rectangular cross-section should be carried out with a bending radius of at least twice the thickness of the terminal, and round-section terminals with a bending radius of at least two diameters of the terminal. The output section at a distance of 1 mm from the body of the body should not be subjected to bending and torsional deformations. Trimming of unused pins of microcircuits is allowed at a distance of 1 mm from the body of the case.

Tinning and soldering chips

The main method of connecting microcircuits to printed circuit boards is soldering the leads, which provides a fairly reliable mechanical fastening and electrical connection of the microcircuit leads to the board conductors.

To obtain high-quality soldered joints, the leads of the microcircuit case are tinned with solders and fluxes of the same brands as when soldering. When replacing microcircuits in the process of setting up and operating REA, soldering is carried out with various soldering irons with a solder limit temperature of 250 C, maximum soldering time is not more than 2 s and the minimum distance from the body of the body to the solder boundary along the lead length is 1.3 mm. The quality of the tinning operation should be determined by the following features:

the minimum length of the tinning section along the length of the lead from its end must be at least 0.6 mm, moreover, the presence of "icicles" at the ends of the microcircuit leads is allowed;

uniform solder coating of leads;

no jumpers between pins.

It is necessary to maintain and periodically monitor (after 1 ... 2 hours) the temperature of the soldering iron tip with an error of no worse than ± 5 C. In addition, control of the contact time of the microcircuit pins with the soldering iron tip should be ensured, as well as control of the distance from the body of the case to the solder boundary along the length of the leads . The tip of the soldering iron must be grounded (transient grounding resistance is not more than 5 ohms).

The spreading of solder from the side of the housings must be limited to the boundaries of the pads. The end face of the output may be non-tinned. Mounting plated holes must be filled with solder to a height of at least 2/3 of the board thickness.

Through the solder, the contours of the leads included in the connection should appear. When soldering, it is not allowed to touch the lead insulators with molten solder and the solder to flow under the base of the case.

A one-time correction of soldering defects of individual leads is allowed. When correcting defects in the soldering of microcircuits with pin leads, it is not allowed to correct defective connections from the side of installing the case on the board.

After soldering, the places of soldered joints must be cleaned of flux residues with a liquid recommended in the specifications for microcircuits.

Installation of microcircuits on boards.

The installation and fastening of microcircuits on the boards must ensure their normal operation under the operating conditions of the EA.

Chips are installed on two- or multilayer printed circuit boards, taking into account a number of requirements, the main of which are:

obtaining the required packing density;

reliable mechanical fastening of the microcircuit and electrical connection of its outputs with the conductors of the board;

the possibility of replacing the microcircuit during the manufacture and configuration of the node;

effective heat removal due to air convection or with the help of heat sink tires;

the possibility of coating with moisture-proof varnish without getting it into places that are not to be coated.

Microcircuits with a distance between pins that is a multiple of 2.5 mm must be placed on the board so that their pins coincide with the nodes of the board grid.

If the strength of the connection of all the pins of the microcircuit with the board under the given operating conditions is less than the triple value of the mass of the microcircuit, taking into account dynamic overloads, then an additional mechanical fastening is used.

If necessary, the board with installed microcircuits must be protected from climatic influences. Microcircuits must not be placed in the magnetic fields of transformers, chokes and permanent magnets.

Forming the leads of components is an integral technological process at every installation site. More than 50% of DIP components require molding before hand assembly, and more than 80% before the selective soldering process. There are several reasons for this operation:

Horizontal installation of axial components (resistors, diodes, etc.). Requires "U" molding.
Vertical installation of axial components. Forming of conclusions by "fountain" is required.
Installing radial (capacitors, LEDs, etc.) components at a certain height. Requires the formation of conclusions with a ZIG-lock.
Horizontal installation of radial components. Requires 90 degree shaping.
Assembly of components on a selective soldering machine. Requires 90 degree lead molding and a ZIG lock.

Shaping the leads of axial components

Automating the lead forming process for axial components is the easiest. This is due to the symmetrical geometry of the location of the leads - it is easier to feed them into the molding installation (if the components are from a tape, then the leads do not deform when the tape is pulled). It is for this reason that a large number of installations for this type of radioelements are presented on the market.

There are two basic types of axial lead molding: "U" molding and "f" (fountain) molding. It is also possible to add a ZIG-lock, which will allow you to firmly install the components in the PCB hole. The operations of forming leads and forming a ZIG-lock can be combined in one installation, or divided into two operations. The image below shows one of the examples of equipment selection.

Forming and trimming the conclusions of radioelements

Devices for forming the conclusions of radioelements. When mounting blocks of electronic equipment, various types of mounted radio elements (transistors, resistors, diodes, etc.) are most widely used. Depending on the nature of production, the installation of mounted radio elements of the circuit on printed circuit boards is carried out manually or mechanized. Mounted radio elements are installed on printed circuit boards after preliminary bending of their leads in accordance with the distances between the annular ends of the printed conductors. In single and small-scale production, the bending of the leads of radioelements is in most cases carried out according to a template or in place using an assembly tool. The location of parts on the board, depending on the configuration of the bending of the leads, may be different.

The simplest and most commonly used form of lead bending is U-shaped. It is convenient to carry out such molding with the help of a desktop fixture by the innovator V. D. Krasavin.

The device consists of the following main components and parts: body, adjusting screw, matrix, bending mechanism and lever. The adjusting screw provides adjustment of the fixture to various sizes of the arms of the radioelement.

The molding of the radioelement leads is carried out as follows: the force applied to the lever is transmitted to the bending mechanism, which, in turn, by means of spring-loaded inserts, acts on the clamp levers designed to stabilize the radioelement leads located in the mounting grooves of the fixture matrix. Such a connection is needed so that after pressing the leads in the mounting grooves, the bending mechanism (punches) continues to move and forms the configuration of the leads. The device makes it possible to improve the quality of forming the leads and eliminate the need to manufacture devices for each standard size of the radio element.

Innovators A. M. Mishin and N. K. Rogov developed an automatic machine for molding radio elements with axial leads (resistors, capacitors, diodes). The molding of the conclusions of the radioelements is made in the form of a U-shaped straight form and a U-shaped with a bend.

When molding, the machine is connected to a 220V network, then safety catchers are installed at a certain distance and radio elements with axial leads are inserted into the guide catchers.

To bring the machine into working condition, it is turned on, and the radio element moves along the bevel of the catchers. With the help of the laying mechanism, the elements are fed from the plate to the matrix and the forming punch. The punch, moving, forms the conclusions of the radioelement. As soon as the conclusions are finally formed, the punch unlocks the matrix, freeing the way for the movement of the radio element, and the radio element falls into the receiving device. The next element is then inserted and the molding process is repeated.

The introduction of the machine allows you to increase labor productivity several times.

The automatic machine of innovators E. S. Ivanov and M. A. Lutsky is designed to prepare radial and tape leads of resistances of the VS and ULM types for installation. The process of preparation for installation consists of the following operations: straightening and preliminary trimming, paint firing, paint removal, fluxing, maintenance and shaping and cutting to size.

Rice. 1. A device for forming the conclusions of radioelements.

The machine consists of a base, a drive, a camshaft with mechanisms, a loading mechanism, a carriage with a cassette, feed mechanisms, straightening and pre-cutting, firing and deinking units,

Rice. 2. Automatic machine for forming the conclusions of radioelements.

fluxing and tinning, beading and cutting to size. Loading of the automatic machine is carried out by means of cartridges with a capacity of 200 elements. There is a special cassette in which the container is installed for the elements coming in a cardboard container and located in it in parallel rows. For elements arriving in bulk, there is a cassette that imitates containers. The set of elements in the cassette is carried out manually.

The prepared cassette is installed in special grooves of the carriage until it stops. In this case, the carriage must be in its original position. After turning on the machine, the grippers of the loading mechanism approach the carriage, grab one row of elements in the cassette, pull them out and feed them into the process flow, which is a slot formed by two guide plates. After picking up a row of elements, the carriage moves forward, bringing the next row of elements into the gripping position.

A full cycle of the loading mechanism is carried out in eight revolutions of the main camshaft. The comb of the feed mechanism after the departure of the first element of the filed row moves the remaining elements in a step of 12 mm, feeding the next element. The hearth mechanism transfers the elements to the position in increments of 80 mm. In working positions, the elements are pressed against the guides by flat springs to prevent jumping out under the influence of the working bodies. After the elements are fed to the step, all the working mechanisms that process the outputs come to the upper position, in which the corresponding technological operations are performed in each working position.

After the last element has left the loading zone, the loading mechanism delivers the next one to the technological chute. a number of elements. The supply of elements along the flow is carried out uninterruptedly until the end of the elements in the cassette. At the end of the elements in the cassette, the automatic stop of the machine can be performed in two ways. In the case of preparing elements of the same denomination, the stop can be made after taking the last row from the cassette and feeding it into the process flow. In this case, an uninterrupted supply of elements is achieved after changing the cassette and starting the machine. At the same time, the productivity of the machine is maximum. In the case of preparation of elements of different denominations, the stop is carried out after the last element exits the process flow into the receiving container. This is necessary to prevent displacement of different denominations. After the machine stops, the carriage is recharged. The recharge and launch time is a few seconds.

Rice. 3. Attachment for trimming the pins of micromodules.

The productivity of labor with the introduction of the machine increases by 2.5 times.

Device for trimming the outputs of micromodules. Innovators R. M. Osipov, V. V. Vasiliev and V. V. Chistok developed a device for trimming the leads of micromodules (Fig. 3). It consists of a base on which holes are drilled for the outputs of micromodules, a bracket with a screw for fixing the fixture at the workplace, a knife made of carbon tool steel, a guide bracket, a stop for the knife, a spring for returning the knife to its original position and a receiving device for cutting conclusions. This device allows you to simultaneously cut the leads of micromodules to a predetermined length, while labor productivity increases by 2 times compared to the manual method.

TO Category: - Tools for electrical work

Microcircuits are exposed to various external factors: mechanical, thermal, chemical and electrical. Mechanical influences are applied to microcircuits during the operations of assembly, molding and cutting of leads, installation and gluing them to the board. Temperature effects are associated with tinning, soldering, and dismantling operations. Chemical effects are manifested during fluxing, cleaning the boards from flux residues, moisture protection and dismantling. Electrical impacts are associated with the adjustment and testing of REA, as well as the appearance of static electricity charges, when it is necessary to take special measures to reduce and remove static charges.

In the "Reference Information" section, the values of the microcircuit parameters for two operating modes are given.

Maximum allowable electrical modes are application modes within which the microcircuit manufacturer ensures its performance during the operating time established in the technical specifications.

Limit electrical modes are application modes in which the parameters of the microcircuits are not regulated, and after the removal of the impact and the transition to the maximum permissible electrical modes, the electrical parameters correspond to the norm. Outside of these modes, the chip may be damaged.

Incorrect modes of operation and application can lead to defects in microcircuits, manifested in violation of the tightness of the package, etching of the coating material of the packages and their marking, overheating of the crystal and leads, disruption of internal connections, which can lead to gradual and complete failures of microcircuits.

moldingmicrocircuit pins

Forming of terminals of rectangular cross section must be carried out with a bending radius of at least twice the thickness of the terminal, and round terminals - with a bending radius of at least two diameters of the terminal (unless a specific value is indicated in the specification). The output section at a distance of 1 mm from the housing body should not be subjected to bending and torsional deformations. Trimming of unused pins of microcircuits is allowed at a distance of 1 mm from the body of the case.

In the process of molding and trimming operations, chips and notches of glass and ceramics are not allowed in the places where the leads are embedded in the housing body and the housing is not deformed. In amateur radio practice, the formation of leads can be carried out manually using tweezers, observing the precautions given,

preventing violation of the tightness of the microcircuit housing and its deformation.

Tinning and soldering chips

To obtain high-quality solder joints, the leads of the microcircuit case are tinned with solders and fluxes of the same brands as when soldering. When replacing microcircuits in the process of setting up and operating REA, soldering is carried out with various soldering irons with a limiting solder temperature of 250 ° C, a limiting soldering time of not more than 2 s, and a minimum distance from the body of the case to the solder boundary along the lead length of 1.3 mm.

The quality of the tinning operation should be determined by the following features:

the minimum length of the tinning section along the length of the lead from its end must be at least 0.6 mm, and the presence of "icicles" at the ends of the microcircuit leads is allowed;

uniform coating of lead solders;

no jumpers between pins.

When tinning, do not touch the pressure seals of the body with solder. The melted solder must not get on the glass and ceramic parts of the case.

It is necessary to maintain and periodically control (after 1 ... 2 hours) the temperature of the soldering iron tip with an error of no worse than ± 5 ° C. In addition, control of the contact time of the microcircuit pins with the soldering iron tip, as well as control of the distance from the body of the case to the boundary solder along the length of the leads. The tip of the soldering iron must be grounded (transient grounding resistance is not more than 5 ohms).

the maximum temperature of the soldering iron tip for microcircuits with planar leads is 265°C, with pin leads 280°C;

the maximum time for touching each output with a soldering iron tip is 3 s;

the minimum time between soldering adjacent leads is 3 s;

the minimum distance from the housing body to the solder boundary along the lead length is 1 mm;

the minimum time between re-soldering of the same pins is 5 min.

When soldering housings of microcircuits with planar leads, the following are allowed: jellied form of soldering, in which the contours of individual leads are completely hidden under the solder from the soldering side of the connection on the board; incomplete solder coverage of the surface of the contact pad along the soldering perimeter, but not more than in two places, not exceeding 15% of the total area; cone-shaped and rounded solder runs in places where the soldering iron is torn off, a slight displacement of the lead within the contact area, solder spreading (only within the length of the leads suitable for mounting).

The spreading of solder over the pins of the microcircuits should not reduce the minimum distance from the case to the place of soldering, i.e., be within the area suitable for installation and specified in the technical documentation. At the ends of the leads, the absence of solder is allowed.

A one-time correction of soldering defects of individual leads is allowed. When correcting defects in soldering microcircuits

with pin leads, it is not allowed to correct defective connections from the side where the case is installed on the board.

After soldering, the places of soldered joints must be cleaned of flux residues with a liquid recommended in the specifications for microcircuits.

InstallationAndfastening chips on boards

Installation and fastening of microcircuits on the boards should ensure their normal operation under the operating conditions of REA.

Chips are installed on two- or multilayer printed circuit boards, taking into account a number of requirements, the main of which are:

obtaining the required packing density; reliable mechanical fastening of the microcircuit and electrical connection of its outputs with the conductors of the board;

the possibility of replacing the microcircuit during the manufacture and configuration of the node;

efficient heat dissipation due to air convention or heat-dissipating tires;

exclusion of deformation of microcircuit cases, since a deflection of a board of a few tenths of a millimeter can lead either to cracking of the sealing seams of the case, or to deformation of the bottom and separation of the substrate or crystal from it;

the possibility of coating with moisture-proof varnish without getting it into places that are not to be coated.

The step of installing microcircuits on boards must be a multiple of 2.5; 1.25 or 0.5 mm (depending on case type). Microcircuits with a distance between pins that is a multiple of 2.5 mm should be placed on the board so that their pins coincide with the nodes of the board grid.

If necessary, the board with installed microcircuits must be protected from climatic influences. Microcircuits must not be placed in the magnetic fields of transformers, chokes and permanent magnets.

Microcircuits with pin leads are installed only on one side of the board, with plenary leads - either on one side or on both sides of the board.

To orient the microcircuits on the board, "keys" must be provided that determine the position of the first output of the microcircuit.

Chips in cases of type 1 should be installed on the board in metallized holes without additional fastening with a gap of 1 + 0.5 mm between the mounting plane and the plane of the case base.

To improve mechanical fastening, it is allowed to install microcircuits in type 1 cases on insulating gaskets with a thickness of 1.0x1.5 mm. The gasket is attached to the board or the entire plane of the base of the case with glue or enveloping varnish. The gasket should be placed under the entire area of the body or between the terminals on an area of at least 2/3 of the base area; at the same time, its design should exclude the possibility of touching the protruding lead insulators.

Microcircuits in type 2 packages should be installed on boards with plated holes with a gap between the board and the base of the package, which is provided by the pin design.

Microcircuits in type 3 cases with formed (hard) leads are mounted on a board with metalized holes with a gap of 1 + 0.5 mm between the mounting plane and the case base plane. Chips with moldable (soft) leads are mounted on the board with a gap of 3 + 0.5 mm. If the equipment is subjected to increased mechanical stress during operation, then when installing microcircuits, rigid gaskets made of electrically insulating material should be used. The gasket must be glued to the board and the base of the case, and its design must ensure the integrity of the sealed inputs of the microcircuit (the place where the leads are embedded in the body of the case).

Installation of chips in cases of types 1-3 on switching boards using separate intermediate washers is not allowed.

Microcircuits in type 4 cases with molded leads can be installed close to the board or on the gasket with a gap of up to 0.3 mm; while additional fastening is provided by enveloping varnish. The gap can be increased up to 0.7 mm, but the gap between the base plane of the case and the board must be completely filled with glue. It is allowed to install microcircuits in type 4 cases with a gap of 0.3 ... 0.7 mm without additional fastening, if increased mechanical effects are not provided. When installing microcircuits in type 4 cases, the free ends of the leads are allowed to move in the horizontal plane within ± 0.2 mm to align them with the contact pads. In the vertical plane, the free ends of the leads can be moved within ± 0.4 mm from the position of the leads after molding.

It is recommended to glue chips to boards with VK-9 or AK-20 glue, as well as with LN mastic. The drying temperature of materials used for fastening chips to boards should not exceed the maximum allowable for the operation of the chip. The recommended drying temperature is 65 ± 5°C. When gluing chips to the board, the pressing force should not exceed 0.08 µPa.

It is not allowed to glue microcircuits with glue or mastic applied in separate dots to the base or ends of the case, as this can lead to deformation of the case.

To increase resistance to climatic influences, boards with microcircuits are usually coated with protective varnishes UR-231 or EP-730. Optimum coating thickness with UR-231 varnish is 35...55 µm, with EP-730 varnish - 35...100 µm. Boards with microcircuits are recommended to be coated in three layers.

When varnishing boards with chips installed with gaps, the presence of varnish under the chips in the form of jumpers between the base of the case and the board is unacceptable.

When installing microcircuits on boards, it is necessary to avoid efforts that lead to deformation of the case, peeling off the substrate or crystal from the seat in the case, breakage of the internal connections of the microcircuit.

Protection of microcircuits from electrical influences

Due to the small size of microcircuit elements and the high packing density of elements on the crystal surface, they are sensitive to static electricity discharges. One of the reasons for their failures is exposure to static electricity discharges. Static electricity causes electrical, thermal and mechanical effects, leading to the appearance of defects in microcircuits and the deterioration of their parameters.

Static electricity has a negative effect on MOS and MOS devices, some types of bipolar devices and microcircuits (especially TTLSH, which break through at a solar energy 3 times less than TTL). Metal gate MOS devices are more susceptible to SC than silicon gate devices.

Static electricity always accumulates on the human body when it moves (walking, moving arms or body). In this case, potentials of several thousand volts can accumulate, which, when discharged to an element sensitive to solar cells, can cause defects, degradation of its characteristics or destruction due to electrical, thermal and mechanical influences.

To detect and control the level of SE and to eliminate or neutralize it, various devices and devices are used that provide the same potential of the operator's tools and semiconductor devices by using electrically conductive materials or grounding. For example, grounding (anti-static) bracelets, fastened to the wrist and connected through high resistance (1 ... the charge of the solar cell can drain to the ground.

In addition, protective conductive mats, tables and chairs made of conductive coating, grounded operator clothing (gowns, sleeves, veils) made of antistatic material (cotton or synthetic materials impregnated with antistatic solutions, material with an interwoven screen made of stainless steel film) are used.

To reduce the effect of static electricity, it is necessary to use work clothes made of low-electrifying materials, for example, cotton gowns, shoes with leather soles. It is not recommended to use clothes made of silk, nylon, lavsan.

To cover the surfaces of work tables and floors with low-electrifying materials, it is necessary to take measures to reduce the specific surface resistance of the coatings. Work tables should be covered with metal sheets 100x200 mm in size, connected through a limiting resistance of 10 6 Ohm to a ground bus.

Equipment and tools that do not have mains power are connected to the ground bus through a resistance of 10 6 ohms. Equipment and tools that are powered by the mains are connected directly to the ground bus.

Continuous contact of the operator with the "ground" must be ensured using a special antistatic bracelet connected through a high-voltage resistor (for example, KLV type for a voltage of 110 kV). In the working room, it is recommended to ensure the humidity of the air is not lower than 50-60%

Dismantlingmicrochips

If microcircuits with plenary leads are dismantled, then the varnish should be removed in the places where the leads are soldered, the leads should be soldered in a mode that does not violate the soldering mode indicated in the microcircuit's passport, the ends of the leads should be raised at the places where they are embedded in a pressure seal, and the microcircuit should be removed from the board by thermomechanical means using a special a device heated to a temperature that excludes overheating of the microcircuit case above the temperature indicated in the passport. The heating time should be sufficient to remove the microcircuit without cracks, chips and violations of the case design. The ends of the leads can be lifted to a height of 0.5 ... 1 mm, while excluding the bending of the leads at the termination points, which can lead to depressurization of the microcircuit.

When dismantling microcircuits with pin terminals, the varnish is removed in the places where the terminals are soldered, the terminals are soldered with a special soldering iron (with solder suction), the microcircuit is removed from the board (avoiding cracks, glass chips and deformation of the case and terminals). If necessary, it is allowed (if the case is attached to the board with varnish or glue) to remove microcircuits in a thermomechanical way, which excludes overheating of the case, or with the help of chemical solvents that do not affect the coating, marking and material of the case.

The possibility of reusing dismantled microcircuits is indicated in the technical specifications for their supply.

3.1.7 Security questions

What is an integrated microcircuit?

How are integrated circuits classified by manufacturing technology?

What subgroups are ICs divided into by the number of elements?

How are IS classified by function?

Determine the purpose of analog and digital ICs.

What is IC failure rate?

What are the advantages and disadvantages of ICs?

Define the element and component of an integrated circuit.

Give the definition of an unpackaged integrated circuit, MIS, SIS, LSI, VLSI.

What is a series of integrated circuits.